Conductive particle, its manufacturing method and anisotropic conductive adhesive
US10508225B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Sep 7, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Nov 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides a conductive particle, its manufacturing method and the anisotropic conductive adhesive. The conductive particle comprises a rigid inner core, a resin layer covering an outer surface of the rigid inner core, and a conductive layer covering an outer surface of the resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.