Evaporative cooling in additive manufactured heat exchangers
US10508864B2 · kind B2 · utility
1Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Aug 14, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/004
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchanger includes a plate with an external surface, a channel, and a nozzle. The external surface bounds an interior of the plate. The channel is disposed in the heat exchanger and passes through a portion of the interior. The nozzle is integrally disposed in the heat exchanger, extends through a portion of the external surface, and is fluidly connected to the channel. The nozzle is configured to transport a liquid from the channel, through the external surface, and to distribute the liquid onto a portion of the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.