High/low temperature contactless radio frequency probes
US10509054B2 · kind B2 · utility
1Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jun 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q13/106
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A contactless radio frequency (RF) probe. The RF probe includes a dielectric substrate, at least one waveguide comprising an electric field configured to increase the coupling between the dielectric substrate and the at least one waveguide, and an air gap separating the dielectric substrate and the at least one waveguide to prevent thermal loading, thermal expansion, and material deformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.