Chip on film (COF) single-layer flexible printed circuit board and liquid crystal display (LCD) having the same
US10509278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10136
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure relates to a chip on film (COF) single-layer flexible printed circuit board, including: a flexible packaging substrate including a bonding area and a controlling chip being packaged on the flexible packaging substrate. The bonding area of the flexible packaging substrate is configured to bond with a bonding area of an array substrate. The controlling chip electrically connects to the bonding area of the flexible packaging substrate. The controlling chip and the bonding area of the flexible packaging substrate are configured on the same side of the flexible packaging substrate, and a portion of the flexible packaging substrate is bent at least one time. As such, the controlling chip faces away the array substrate, the cost and the complexity of the post-process may be reduced, and the COF single-layer flexible printed circuit board may be shipped in the folding manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.