Electronic component and manufacturing method thereof
US10510479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.