Heat transfer in magnetic assemblies
US10510485B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F37/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.