Radio frequency communication systems
US10510694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | May 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged radio frequency (RF) module is disclosed. The module can include a substrate, a first die electrically and mechanically attached to the substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material, and a lid attached to the substrate. The first die comprises a silicon-based die, such as an RF switch die, and the second die comprises a compound semiconductor die, such as an RF amplifier. The encapsulating material can protect electrical connections between the first die and the substrate. The substrate and the lid at least partially define an air cavity within which the first and the second die are mounted. An active surface of the second die is exposed to the air cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.