Magnetic coupling package structure for magnetically coupled isolator with duo leadframes and method for manufacturing the same
US10510728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.