Light emitting diode package and manufacturing method thereof
US10510933B1 · kind B1 · utility
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3References
20Claims
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Key dates
| Filing date | Aug 12, 2019 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Aug 12, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A light-emitting diode package includes a light-emitting diode chip disposed in a housing, a first phosphor configured to emit green light, and a second and a third phosphor configured to emit red light. White light is configured to be formed by a synthesis of light emitted from the light-emitting diode chip, the first phosphor, the second phosphor, and the third phosphor. At least one of the second and third phosphor is a nitride based phosphor that includes at least one of MSiN2, MSiON2, and M2Si5N8, where M is one of Ca, Sr, Ba, Zn, Mg, and Eu.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.