Systems and methods for manufacturing stacked circuits and transmission lines
US10511073B2 · kind B2 · utility
0Cited by
204References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2015 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Dec 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/19
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.