Laser module with a flattened structure on a mobile device for image measurement
US10511137B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Apr 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0234
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laser module with a flattened structure is installed on a mobile device for a camera program installed in the mobile device to operate photo-taking and image measurement. The laser module includes a printed circuit board (PCB), a photodiode embedded on the PCB, an automatic power control integrated circuit embedded on the PCB, and a laser diode chip electrically connected to the PCB. The flattened structure has a top surface of the PCB, a detection surface of a photodiode chip, a first surface of the automatic power control integrated circuit, a connecting surface of the laser diode chip sharing a common plane surface for operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.