Flexible circuit board with improved bonding position accuracy
US10512158B2 · kind B2 · utility
0Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Dec 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.