Low dust additives for joint compounds and joint compounds thereof
US10513461B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2017 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Feb 15, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/22
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive comprises micro-crystalline wax or micro-crystalline wax emulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.