Bisphenol-A-free cold draw laminating adhesive
US10513643B2 · kind B2 · utility
1Cited by
15References
9Claims
0Family size
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Key dates
| Filing date | Nov 10, 2015 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Feb 1, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D167/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.