Method for leveling a 3-D printing platform and a 3-D platform with adjustable level
US10514678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2016 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49019
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adjustable level 3-D printing platform includes a platform, three support posts, and an adjusting component by which heights of the three support posts are adjustable. The bottom of the build platform includes at least one socket to engage with a ball end of one of the three support posts, thereby enabling two point leveling. The adjusting component is configured to simultaneously adjust a height of the at least three support posts using a first arm and a second arm, each connected to the build platform at respective pivot points and configured to apply respective clamping forces to the support posts. The printing platform further includes at least one sensor leveling system that deploys a probe, measures a relative probe state, and compares the measurement to a predetermined value. During the leveling processes, the 3-D printer is configured to provide sensory feedback.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.