Plasma treatment apparatus and method of plasma treating a substrate using the same
US10515784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2016 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | May 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/44
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments of the inventive concept provide a plasma treatment apparatus with a substrate support unit, a plasma unit, a first rotation driving unit, and a gas supply part. The substrate support unit supports a substrate. The plasma unit generates a plasma and provides the plasma to the substrate. The first rotation driving unit is coupled to the plasma unit to rotate the plasma unit with respect to the substrate support unit. The gas supply part supplies a source gas to the plasma unit. The plasma unit includes a body, a first electrode located in the body, a second electrode located in the body and facing the first electrode, and a pipe located between the first and second electrodes to flow the source gas therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.