Mechanisms for etching apparatus and etching-detection method
US10515813B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2013 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | May 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of mechanisms of an etching apparatus are provided. The etching apparatus includes a processing chamber. The etching apparatus also includes a gas distribution plate disposed in the processing chamber and comprising a number of exhaust openings. The etching apparatus further includes a number of end-point detectors disposed on the gas distribution plate. The gas distribution plate is configured to spurt gas into the processing chamber via the exhaust openings during a semiconductor process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.