Patent · US Active

High frequency system, communication link

US10516207B2 · kind B2 · utility

0Cited by

8References

17Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Ralf Reuter · Landshut, DE
Ziqiang Tong · Ottobrunn, DE

Key dates

Filing date	May 17, 2017
Grant date	Dec 24, 2019
Priority date	—
Expiry date	Aug 14, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15192
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A device is disclosed. The device includes a wire board including metallic wiring and a first microchip connected to the metallic wiring. The first microchip includes a first radiating element configured to operate a first frequency. The device further includes a second microchip connect to the metallic wiring. The second microchip includes a second radiating element configured to operate at the first frequency. A main radiating element is also included. The main radiating element is configured to operate at a second radio frequency. The first microchip and the second microchip are physically placed such that the first radiating element faces the second radiating element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.