Systems and methods for providing a high speed interconnect system with reduced crosstalk
US10517167B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2018 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (“CS”) a First Via (“FV”) formed therethrough; disposing a First Trace (“FT”) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (“SV”) formed through the first HDI substrate; disposing a Second Trace (“ST”) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (“TV”) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.