Methods of positioning a component in a desired position on a board, pick and place machines, and sensors for such pick and place machines
US10517199B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2016 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Mar 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49363
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.