Foil body, method for back-injection molding a foil body and back-injection molding tool
US10518447B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2014 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Aug 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2017/9602
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a film body, a method for the back-injection molding of a film body and a back-injection molding tool therefor. In particular, the invention relates to a method for the back-injection molding of layer electrodes (1) for producing touch-sensitive sensors for example for touch screens. Parts of the layer electrode (1), which after the back-injection molding should still be able to move freely, are covered by a sacrificial film (3) before and during the back-injection molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.