Process and additive to improve adhesion of building compositions to substrates
US10519064B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Jul 31, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-containing substrates or polyvinyl chloride-containing substrates, the additive containing (i) a plasticizer that is liquid at 50° C. or lower, has a boiling point of 100° C. or higher, and that has a solubility parameter δ 25° C. between 22.5 MPa1/2 and MPa1/2; (ii) optionally, a filler that has a BET surface area of at least 40 m2/g; (iii) optionally, a biopolymer, (iv) optionally, a protective colloid; and (v) optionally, a water-insoluble film-forming (co)polymer based on ethylenically unsaturated monomers. The invention also covers an additive and a kit of parts suitable for use in the above process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.