Poly(aryl ether) compositions for polymer-metal junctions and polymer-metal junctions and corresponding fabrication methods
US10519277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2481/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.