Dew resistant module for test socket and electronic component testing device having the same
US10520528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2881
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.