Method of producing substrate having alignment mark
US10520761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2018 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Aug 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of producing a substrate having an alignment mark includes a process of forming a lower layer side metal film on a substrate and forming a lower layer side alignment mark base having a lower layer side alignment mark that is a hole, a process of forming an upper layer side metal film on the substrate and the lower layer side metal film, a process of forming a photoresist film on the upper layer side metal film and forming a lower layer side alignment mark overlapping portion overlapping a part of the lower layer side alignment mark with patterning, an etching process of removing with etching selectively portions of the lower and upper layer side metal films not overlapping the lower layer side alignment mark overlapping portion and forming an upper layer side alignment mark that is the upper layer side metal film, and a photoresist removing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.