Substrate treating apparatus and method of treating substrate
US10520819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2018 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | May 23, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/32
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate treating apparatus includes a plurality of conveying rollers arranged in a first direction which is a horizontal direction, and configured to transfer a substrate in the first direction, the substrate being disposed on a plane formed by the first direction and a second direction perpendicular to the first direction, a developer providing nozzle configured to provide a developer onto the substrate to form a developer layer on the substrate, a sensor part for recognizing a position of the substrate, and a vertical moving part configured to move each of the conveying rollers along a third direction which is downward and perpendicular to the first and second directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.