Method of direct wafer mapping by determining operational LEDs from non-operational LEDs using photo-reactive elastomer deposition
US10522709B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Dec 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A photo-curable polymer is deposited on a surface of each LED. A voltage difference is applied across the electrodes of each LED via the unidirectional conductive film, causing the operational LEDs to emit light and cure the photo-curable polymer to form an elastomer layer, while the polymer deposited on the non-operational LEDs will not cure. As such, the PUT will be able to pick up the operational LEDs, while being unable to pick up the non-operational LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.