LED packaging material and manufacturing method of the same
US10522724B2 · kind B2 · utility
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Key dates
| Filing date | May 30, 2019 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | May 30, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/206
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A light-emitting diode (LED) packaging material is formed by compounding graphene with silane or epoxy resin, to improve the defects of manufacturing an LED packaging material only of silane or epoxy resin. The addition of graphene helps improve the performance of the LED packaging material. Also provided is a manufacturing method of a LED packaging material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.