Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same
US10522728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2018 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Feb 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
A chip-scale packaging (CSP) light-emitting device (LED), including a light-emitting semiconductor die, a photoluminescent layer, a chip-side-spacer structure, and a beveled chip reflective structure, is disclosed. The beveled reflective structure is disposed surrounding the chip-edge surfaces of the light-emitting semiconductor die, wherein the chip-side-spacer structure is disposed between the beveled reflective structure and the chip-edge surfaces of the light-emitting semiconductor die. A manufacturing method to fabricate the CSP LED is also disclosed. The CSP LED with a beveled chip reflector can effectively reflect the light radiated from the light-emitting semiconductor die toward the photoluminescent layer so that the light extraction efficiency is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.