Laser cutting of materials with intensity mapping optical system
US10522963B2 · kind B2 · utility
3Cited by
132References
56Claims
0Family size
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Key dates
| Filing date | Aug 29, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Aug 29, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.