Distributed differential interconnect
US10523272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0233
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus is disclosed that implements a distributed differential interconnect. In an example aspect, the electronic apparatus includes a first endpoint having a first differential connection interface and a second endpoint having a second differential connection interface. The electronic apparatus also includes a differential interconnect coupled between the first differential connection interface and the second differential connection interface. The differential interconnect includes a plus pathway and a minus pathway. The plus pathway extends between the first differential connection interface and the second differential connection interface, with the plus pathway including multiple plus conductors. The minus pathway extends between the first differential connection interface and the second differential connection interface, with the minus pathway including multiple minus conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.