Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board
US10524349B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Jun 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.