Apparatus and methods related to conformal coating implemented with surface mount devices
US10524350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2016 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Aug 10, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.