Roller transfer application method and application device for hot-melt adhesive
US10525501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2014 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Aug 22, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/304
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a roller transfer application method for a hot-melt adhesive, a coater head having a slot in a direction towards an axis center of a pattern roller is provided to face a pattern surface of the pattern roller; and by supplying hot-melt adhesive, which is supplied from a hot-melt adhesive supply device, in a thin-film state to a pattern top surface of the pattern roller, thin-film hot-melt adhesive is thus only supplied to the top surfaces of protrusions of the pattern roller. By opening an on-off-type hot-melt adhesive supply control valve, which is attached to the coater head, at a timing that an adhesive opening (the slot) on the bottom surface of the coater head faces application zones on the pattern surface of the pattern roller, the hot-melt adhesive is supplied only to the top surfaces of the pattern roller protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.