Laser system and processing conditions for manufacturing bioabsorbable stents
US10525552B2 · kind B2 · utility
0Cited by
17References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 6, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Jan 16, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention involves laser machining polymer substrates to form a stent with laser parameters that minimize damage to the substrate in a surface region adjacent to the machined edge surface. The wavelength and pulse width are selected for this unique application and they can be controlled to minimize the surface modifications (such as voids, cracks which are induced by the laser-material interaction) which contribute to the variation in mechanical properties with distance from the edge surface, bulk mechanical properties, or a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.