Resin composition and resin molded article
US10526486B2 · kind B2 · utility
4Cited by
1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Aug 23, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.