Anaerobically curable compositions
US10526509B2 · kind B2 · utility
1Cited by
11References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2018 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Apr 23, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/08
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An anaerobically curable composition comprising an anaerobically curable component that is a combination of a solid resin component and a solid anaerobically curable monomer. A curing component for curing the anaerobically curable component is included. The composition is solid and has a melting point in the range from 30° C. to 100° C. The composition is dry to touch and can be used to form articles of manufacture such as a tape, an elongate filament, a gasket, a patch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.