Composition for forming adhesive layer of dicing film, and dicing film
US10526513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2014 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Apr 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.