Resilient floor
US10526793B2 · kind B2 · utility
40Cited by
212References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2018 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49623
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of assembling resilient floorboards is disclosed that includes the step of bending an edge of a floorboard during the assembling. The bending reduces the force required for connection of the edge to another edge of a juxtaposed floorboard. The floorboards may be provided with a mechanical locking system for vertical and horizontal locking of two adjacent floorboards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.