Devices, methods, and systems for thermal management
US10527355B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Jul 20, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2015/0216
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer device, and methods and systems using such devices, including a major surface wall forming a bottom side of the device; a first hermetic chamber of a first design and with the surface wall forming a bottom wall of the first vapor chamber; a second hermetic chamber of a second design, positioned adjacent to the first chamber along a length of the first surface wall, and with the surface wall forming a bottom wall of the second vapor chamber. The first chamber includes a first heat transfer medium and a first wick arranged to transport the first heat transfer medium to an evaporator region of the first chamber. The second chamber includes a second heat transfer medium and a second wick arranged to transport the second heat transfer medium to an evaporator region of the second chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.