Chip on glass protection
US10527896B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various circuits may benefit from suitable protection. For example, certain displays, such as active matrix liquid crystal displays, may benefit from enclosures configured to protect driver circuits from high intensity radiated fields. A system can include a first protective conductive coating layer. The system can also include a first insulating layer on the first protective conductive layer. The system can further include a signal conductive layer on the insulating layer. The system can additionally include a driver layer mounted to the signal conductive layer. The system can also include a second insulating layer above the driver layer. The system can further include a second protective conductive coating layer on the second insulating layer. The system can additionally include one or a plurality of conductive elements disposed between the first protective conductive coating layer and the second protective conductive coating layer to form an enclosure around the driver layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.