Ceramic carrier and sensor element, heating element and sensor module, each with a ceramic carrier and method for manufacturing a ceramic carrier

US10529470B2 · kind B2 · utility

Assignee

• Heraeus Nexensos GmbH · DE

Inventors

• Thomas Loose · Gelnhausen, DE
• Stefan Dietmann · Haiterbach, DE
• Alfred Fleckenstein · Hösbach, DE
• Dieter Teusch · Bruchköbel, DE

Key dates

• Filing date: Mar 25, 2015
• Grant date: Jan 7, 2020
• Expiry date: Jun 29, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2015/0046
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An Al2O3 carrier has a thin-film structure of platinum or a platinum alloy arranged thereon. The carrier and/or the thin-film structure are adapted to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure include a surface of the carrier in the region of the thin-film structure is smoothed at least in sections to reduce the adhesion and/or a surface of the carrier has an intermediate layer on which the thin-film structure is arranged. The thermal expansion coefficient of the intermediate layer is from 8*10−6/K to 16*10−6/K, in particular from 8.5*10−6/K to 14*10−6/K, and/or the thin-film structure has at least one conductor path that is undular at least in sections, said conductor path extends laterally along the surface of the carrier.