Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof
US10529657B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The instant disclosure provides a method for manufacturing a package structure of a folding magnetic coupling isolator. The method includes providing a leadframe structure including a frame body and a first and a second leadframes connected to the frame body, the first and second leadframes including first and second chip-mounting portions, first and second coil portions, and a plurality of first and second pins and floated pins; disposing the first and second chips on the first and second chip-mounting portions and establishing electrical connections between the first and second chips and the first and second pins; and rotating the first leadframe relative to the frame body and moving the first leadframe to a position above or under the second leadframe, thereby electrically isolating the first leadframe from the second leadframe. The first coil portion and the second coil portion are aligned with and magnetically coupled to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.