Semiconductor module including package and heat transfer structure
US10529692B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 14, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Nov 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.