Acoustic wave device and manufacturing method for same
US10530333B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | May 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1085
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic wave device that utilizes a plate wave includes a recess in an upper surface of a support substrate. A piezoelectric substrate is located on the support substrate with a first principal surface side facing the support substrate. An IDT electrode is provided on the first principal surface of the piezoelectric substrate. The recess defines a cavity that is surrounded by the support substrate and the first principal surface of the piezoelectric substrate. The IDT electrode faces the cavity. The piezoelectric substrate includes through-holes that communicate the cavity and the second principal surface with each other. Sealing materials are filled respectively in the through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.