Patent · US Active

Hydrogel tie layer

US10531705B2 · kind B2 · utility

4Cited by
70References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 24, 2017
Grant dateJan 14, 2020
Priority date
Expiry dateSep 21, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29K2105/0085
  • WIPO fieldOther consumer goods
  • WIPO sectorOther fields

Abstract

The disclosure relates to articles and components thereof, including outsoles, which can be used in conditions normally conducive to the accumulation of soil. In particular, the articles have substrate body, a tie layer secured to the substrate body, and a material including a hydrogel secured to the tie layer. The material can prevent or reduce the accumulation of soil during use. The presence of the tie layer can minimize or prevent delamination of the hydrogel containing material during normal use.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.