Hydrogel tie layer
US10531705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0085
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The disclosure relates to articles and components thereof, including outsoles, which can be used in conditions normally conducive to the accumulation of soil. In particular, the articles have substrate body, a tie layer secured to the substrate body, and a material including a hydrogel secured to the tie layer. The material can prevent or reduce the accumulation of soil during use. The presence of the tie layer can minimize or prevent delamination of the hydrogel containing material during normal use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.