Device for machining an object by application of laser radiation
US10531985B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2016 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jan 4, 2038 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2009/00897
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for machining an object by laser radiation, by photodisruption. The device includes an observation device for imaging the object and a laser scanning device by which the laser radiation is passed over a predetermined sector of the object for scanning the sector. The device includes the observation device with a first lens for imaging the object; the laser scanning device with a second lens, through which the laser radiation is guided, in which both lenses with regard to the dimension of the regions to be produced in the images and/or with regard to their focal intercept are different from each other. The device alternately images the respective region of the object in a first operating mode by the first lens and in a second operating mode by the second lens. It is thus possible to use in both operating modes a lens adapted to the intended imaging purpose.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.