Resin filling device and resin filling method for magnet embedded core
US10532501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2015 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K1/276
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin filling device includes: a first mold and a second mold provided so as to face each other to sandwich therebetween a laminated iron core and thereby to fix the laminated iron core; a flow path forming member provided to the first mold so as to be engageable with one of the axial ends of the laminated iron core and forming a resin flow path through which a resin flows; and a fitting member provided to the second mold to be fitted into an opening portion of the flow path forming member that is in communication with the resin flow path, wherein the fitting member is provided with a vent portion for discharging air in the resin flow path to outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.