Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
US10532926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Nov 22, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.