Patent · US Active

Method for bonding using adhesive layers with the aid of a laser

US10533077B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignees

Henkel AG & Co. KGaA · DE
TRUMPF LASER- UND SYSTEMTECHNIK GMBH · DE

Inventors

Hans-Georg Kinzelmann · Pulheim, DE
Marcel Blodau · Krefeld, DE
Martin Sauter · Markdorf, DE
Michael Berger · Sharon, US

Key dates

Filing date	Jul 29, 2016
Grant date	Jan 14, 2020
Priority date	—
Expiry date	Feb 22, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2301/504
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.